The liquid coolers are sometimes easier than large air coolers cause you dont have 2 pounds of metal to work around and pull on your mothetboard. The new Corsair modrls are much easier to install than the Antec. To each their own though.
Yeah I was looking at the Corsair H100, it's actually only $4 different from the Antec 920 and I could run it in a push/pull configuration on the HAF X! I found this video of a guy doing it, but I wonder if its a good idea to put the 200mm fans back on top of the case? Maybe this screws up the airflow too by putting that massive radiator on there? What do you guys think? Cue to 17 minutes to see the radiator placement. 18:30 minutes to see the 200mm fan placement. Here's another one, he's talking about bending pins or something. At 7:30 he has a video of the system running, but I wish he'd show the top, I wonder what happens with those top fans.
No, push/pull with 2 120 MM fans. And match them if possible. With push/pull you want your fans to match exactly or very close on their CFM etc. The 200MM that are standard on the HAF932 and HAFX suck. Bigger fans do not mean better. Check the CFM on fans. He's talking about the radiator FINS (not pins I think you were saying)? The screws have to go all the way through the fan shrouds and then into the radiator, you just want to be sure when mounting your fans to the rad that you don't screw it all the way down or it WILL hit one of the rad fins and possibly bend it, obstructing water flow.
LOL! Oh, FINS!! hahahaha I was wondering what the hell he was talking about. Not sure why that didn't make sense to me at the time! Yeah, I think I'll keep the one fan that doesn't obstruct the radiator, but I'll take the other one out.
If the H100 will mount properly to whatever case you get then definitely go with that. I didnt suggest it because most people cannot mount it.
Just bought this: EVGA SuperClocked GeForce GTX 680 2GB ...and this: G.SKILL Ripjaws X Series 16GB (2 x 8GB) ...to connect to this: ASUS P8Z77-V DELUXE ...to go in this: COOLER MASTER HAF X Blue Edition You'll notice they're all blue! It's going to look rad. There's also a window on the side of the HAF X. You can't see it, but right now I'm smiling.
Just picked up my Ivy bridge i7-3770K chip today, only a few more parts to arrive and I can put this beast together!
The IB processors run how because: 1) too concentrated heat. Small die so it cant spread 2) Intel used standard TIM instead of solder to attach the integrated heat spreader. This has about half the heat transfer capacity of the normal solder.
Yeah, I was reading they did a pretty significant redesign for these things and it got kinda weird. I doubt I'm going to push it over 4.5GHz at any time though, and from what I've seen IB runs about 80 degrees around those speeds and works out roughly equivalent to a 4.7GHz SB. That seems plenty fast, I suppose. The only thing is that I'm upgrading from a Kentsfield, so when the price difference from IB to SB is literally $30, it doesn't make much sense to go SB as far as I can see. Especially when most tasks will only require stock voltages and the IB performs better at stock.
Speed doesnt matter hardly at all compared to voltage. Ivy can run 4.5GHz on stock voltage, so you should try and hit that while dropping voltage down by 10%. This, combined with an H100 would probably have you running at 60 degrees load.
Yep, that's what I read too. I have no idea why they would do the second one - but just because that's different than how its been done. And I'm no engineer so I'm not going to try to figure out the technical reasons, but still! Was going to use Ivy for my micro build but looks like I'm going to need a bit more cooling, even if Intel did raise the heat ceiling for the chips.
I really have no idea why Intel went the cheap route either. All their processors (AMD too) have been soldered for many generations now. It sucks from an extreme overclocking perspective, but it really is the best way to do things. Standard TIM will wear out in a couple years and lose some of its ability to transer heat, thus compounding the issue down the road. Solder doesnt have that problem and it transfers heat better. The only reasoning I can think of would be these things: either because it is such a new process node and the processor die is so small that it cant stand the stress from the heat required to use solder or Intel saved a LOT of money with standard thermal interface material. I am guessing the first one. It takes about 150 degrees celcius to melt the solder, that much highly concentrated heat on the very fragile die with a brand new process node and new transistors was probably killing too many processors.
My computer is all together and OMG this thing is freaking amazing. Still messing with software and transferring old files, but WOW. My only gripe is that the case is so huge it doesn't fit under my desk anymore, but that's kind of an awesome thing.